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Application of sodium hypophosphite

Application of sodium hypophosphite




Sodium hypophosphite reduction electroless copper plating has the same chemical nature as other electroless copper plating processes. It also uses a suitable reducing agent to reduce the free copper ions (II) in the copper plating solution to solid copper crystals and plate it on the substrate. An electroless copper plating method to form nanometer or micrometer copper plating on the surface. At present, the sodium hypophosphite reduction electroless copper plating process that has been researched and developed is very similar to the formaldehyde reduction electroless copper plating process, but the reaction mechanism is much more complicated. This is because pure metallic copper does not have catalytic activity for the oxidation reaction of sodium hypophosphite. When it is used as a reducing agent for electroless copper plating, it cannot be achieved by copper particles and silver particles generated during the activation and sensitization stages like the formaldehyde system. Autocatalytic electroless plating reaction.